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Qianli Magnetic Middle Layer BGA Reballing Platform For iPhone 14 Series

SKU: EDA006242102
Sale Sold out Pre-order
Regular price R 849.00
Regular price Sale price R 849.00
Pay in 3, 6, or 12 monthly instalments with

Import Taxes & Duties Included

6-13 business days

In Stock CHN

Processing time: 1-3 days

Description

The Qianli Magnetic Middle Layer BGA Reballing Platform is a specialized tool designed for motherboard reballing. It provides high-precision positioning and strong magnetic attraction to ensure accurate stencil placement during the reballing process.

  • Product Type: BGA Stencils
  • Compatibility: iPhone 14 Series
  • Material: Not specified
  • Key Feature: High-precision positioning
  • Intended Use: Motherboard reballing
  • Design: Compact shape for space-saving
  • Magnet Design: Sliding dislocation for easy handling
  • Processing: CNC high-precision integrated processing
  • Magnetic Strength: Strong magnetic attraction, maintains position under high temperatures
  • Prevention: High-temperature magnetic pressing prevents stencil bulging

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